Development of Lightweight Polymer Laminates for Radiation Shielding and Electronics Applications
نویسندگان
چکیده
The present study portrays the development of lightweight epoxy laminates filled with boron carbide (B4C) and lead (Pb) particles through a novel layered molding curing route. Six different single tri-layers were prepared varying compositions subjected to thermal, radiation shielding, dielectric studies. Radiation shielding test done using narrow beam setup six sources such as Cobalt-57 (Co57-122 keV), Barium-133 (Ba133-356 Sodium-22 (Na22-511 1275 Cesium-137 (Cs137-662 Manganese-54 (Mn54-840 Cobalt-60 (Co60-1170 1330 keV). studies understand constant, loss factor, AC conductivity at temperature frequency ranges. From characterizations, it was found that thermal stability single-layered sample increased respect addition B4C Pb particles, which may be due thermally stable nature particles. samples witnessed superior characteristics ability D (40% Pb) E cladding incident gamma energy 662 keV. constant significantly higher temperatures factor an increase in decreased frequency.
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ژورنال
عنوان ژورنال: International Journal of Polymer Science
سال: 2022
ISSN: ['1687-9422', '1687-9430']
DOI: https://doi.org/10.1155/2022/5252528